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Massimo Conti, Univ. Politecnica delle Marche, Ancona, I
Ermanno Cardelli, Università di Perugia, I
Nectarios Koziris, National Technical Univ. of Athens, GR
Simone Orcioni, Univ. Politecnica delle Marche, Ancona, I
Steering Committee
E. Alarcon, Univ. Polit. Catalunia, Barcelona, E
B. Andersson, Carnegie Mellon University, USA
E. Armengaud,AVL List GmbH, A
J. Becker, Karlsruhe University of Technology, D
A. Brito, Univ. Federal da Paraiba, João Pessoa, BR
E. Cardelli, Università di Perugia, I
M. Coppola, STM, Grenoble, F
W. Elmenreich, Klagenfurt University, A
L. Fanucci, Univ. of Pisa, I
G. Fohler,University of Kaiserslautern, D
V. Frascolla, Intel Mobile Communications, Neubiberg, D
M. Grammatikakis, TEIC, Crete, GR
M. Ismail, Ohio State University, Columbus, USA
R .Kirner,Vienna University of Technology,A
A. König, University of Kaiserslautern, D
G. Kornaros, TEIC, Crete, GR
N. Koziris, National Technical Univ. of Athens, GR
R. Kröger, Univ. Applied Sciences Wiesbaden, D
M. Kucera, Univ. of Applied Sciences, Regensburg, D
A. Ledeczi, Vanderbilt University, USA
N. Martínez Madrid, Reutlingen University, D
G. Masetti, Università degli Studi di Bologna, I
R. Obermaisser, Siegen University, D
S. Orcioni, Università Politecnica delle Marche, Ancona, I
G. Palumbo, Univ. of Catania, I
L. Pieralisi, ARM, UK
P. Puschner, Vienna University of Technology, A
M. Radetzki, Univ.of Stuttgart, D
T. Riesgo, Universidad Politécnica de Madrid, E
B. Rinner, Klagenfurt University, A
I. J. Rudas, Budapest Polytechnic, H
A. Rusu, KTH, Stockolm, S
D. Schröder, Hamburg Univ. of Technology, D
R. Seepold, HTWG Konstanz, D
T.Tarim, Texas Instruments, Dallas, USA
H. Tenhunen, KTH, Stockolm,S
J.A. Tenreiro Machado, Institute of Eng. of Porto, P
A. Trost, University of Ljubljana, Slovenia
V. Turau, Hamburg Univ. of Technology, D
M. Venzke, Hamburg Univ. of Technology, D
T. Waas, Univ. of Applied Sciences, Regensburg, D
M. Wolf, Georgia Tech, USA
F. Wotawa, Graz University of Technology, A
E. Zanaj, Polytechnic Univ. of Tirana, Albania
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